FISCHIONE MODEL 170 ULTRASONIC DISK CUTTER

Cuts a 3 mm specimen with consistent cross sectional area from hard and brittle materials, such as: ceramics, semiconductors, and geological materials.

Ultrasonic Disk cutting is used in continuous or manual mode to produce a 2.3 mm TEM specimen for either plan or cross-sectional view (XTEM).

For a plan view or cross sectional view, a 3 mm disk can be cut from a small sample of about 4x5 mm is glued to an aluminum plate with a low melting polymer.

For the cross-sectional view, one cuts first rectangular wafers (4x5 mm) sample from this sample and additional pieces wafers of silicon, which are used in the preparation of cross-section specimens. and then epoxies these wafers to form a wafer stack with the mat erials of interest centered. .

Second, the bulk samples to be cut to produce plan view specimens, or the wafer stacks pre pared for XTEM, can be readily cored to a 3 or 2.3 mm diameter by this technique in just minutes.

For any kind of cutting, an abrasive slurry compound of either boron nitride or silicon carbide is used as cutting media.

To ensure capturing the specific area of interest in the cut sample, this ultrasonic disk cutter has a microscope attachment, which is easily rotated, into position for specimen observation and positioning.