Produces a dimpled region, which promotes a large electron transparent area in the an ion milled specimen, with a thicker outer rim for better mechanical stability. Dimpling Dimple grinding involves rotating the specimen about one axis while in contact with a grinding wheel, which rotates about an orthogonal axis, providing producing a dimpled specimen with a central area reduced to a thickness of a few microns and a rugged outer rim.

A 3 mm diameter specimen core produced by the X-TEM specimen preparation kit, after it was once cut with a diamond wafering blade to yield 500 – 1000 m m thick slices, into wafers can be flat ground and then dimple polished ground to electron transparency.

The Model 150 provides the option of producing either a conventional dimple or an expended an expanded area that will promote a larger electron transparent area in the ion milled specimen. The expended expanded area is achieved by simultaneously rotating and oscillating the specimen beneath the grinding wheel.

The specimen can be examined in situ under an attachement attached microscope without being dismounted. The microscope fits is mounted directly over the grinding wheel.